Grinding powder for Rough Lapping/Thinning of Silicon Wafers, Quartz, and Ceramics
1. Green Silicon Carbide (GC) Grinding Powder | High-End, Mainstream Choice
Characteristics: High purity, low magnetic impurity content, fine cutting edges, stable self-sharpening properties, controllable damage layer, and fewer scratches.
Suitable for: Optical-grade quartz, aluminum oxide/aluminum nitride ceramics, semiconductor silicon wafers, and rough thinning of optical waveguide glass.
Haixu Abrasives offers Green Silicon Carbide (GC) grinding powders sizes: #240 #280 #320 #360 #400 #500 #600 #700 #800 #1000 #1200 #1500 #2000 #2500 #3000 #4000 #6000 #8000 #10000
2. Black Silicon Carbide (C) Grinding Powder | Cost-Effective Option
Characteristics: Fast cutting rate, low cost, and good self-sharpening; however, it contains higher impurity levels and tends to produce more scratches.
Suitable for: Standard silicon wafers, industrial ceramics, quartz with less stringent requirements, and high-volume rough-thinning slurry applications.
Haixu Abrasives offers Black Silicon Carbide (C) grinding powders sizes: #240 #280 #320 #360 #400 #500 #600 #700 #800 #1000 #1200 #1500 #2000 #2500 #3000 #4000 #6000
3. White Fused Alumina ((WA) Grinding Powder | For Specific Applications
Characteristics: High toughness, controllable iron content (low-iron variants available), and less prone to deep fracturing or chipping.
Suitable for: Certain soft ceramics, crystals sensitive to iron contamination, and intermediate-stage lapping of silicon wafers. Cutting efficiency is lower than that of silicon carbide.
Haixu Abrasives offers White Fused Alumina (WA) grinding powders sizes: #240 #280 #320 #360 #400 #500 #600 #700 #800 #1000 #1200 #1500 #2000 #2500 #3000 #4000 #6000 #8000 #10000
White fused alumina(WA)
4. Diamond Grinding Powder | For Ultra-Hard Substrates (e.g., AlN or SiC Ceramics)
Characteristics: Offers the highest material removal rate with controllable surface damage; however, it comes at a higher cost. Suitable for: Rough thinning of ultra-hard ceramics such as aluminum nitride (AlN) and silicon carbide (SiC); typically used in the formulation of high-end lapping slurries.
In summary, for the preparation of lapping slurries used in the rough thinning of silicon wafers, quartz, and ceramics, black silicon carbide (an economical option) or green silicon carbide (a high-purity, precision-grade option) are the preferred choices. White fused alumina is used for specific, limited intermediate-lapping applications, while diamond abrasive powder is employed for the rough thinning of ultra-hard ceramics like aluminum nitride and silicon carbide.