Abrasive film produced from green silicon carbide

Abrasive film produced from green silicon carbide

Green silicon carbide micropowder is sharp, has excellent self-sharpening properties, and leaves shallow scratches on hard and brittle materials, making it the preferred raw material for precision grinding films in the optoelectronics, ceramics, and semiconductor industries. Below is a summary of grinding films suitable for production using green silicon carbide micropowder.

I. Precision abrasive film for PET polyester film substrate 

1. Circular abrasive film for fiber optic connectors

      1. Coarse Abrasive Polishing Film: Green silicon carbide 600-1000 mesh (15-30μm), removes epoxy resin adhesive from the end face of FC/SC/LC ceramic ferrules.

     2. Semi-Fine Abrasive Polishing Film: Green silicon carbide 2000-3000 mesh (5-9μm), removes tool marks and levels the end face.

     3. Mirror Polishing Film: Green silicon carbide 4000-8000 mesh ultrafine powder, controls end face curvature and reduces fiber insertion loss.

     4. Flexible Abrasive Pads for MPO Multi-Channel Ferrules, Abrasive Pads for Jumper Repair

2. Optical Crystal & Glass Abrasive Film
Coarse Polishing Film: Green silicon carbide 800-1500 mesh; used for processing quartz glass, lens blanks, prisms, sapphire, and calcium fluoride infrared crystals.
Final Ultra-Fine Polishing Film: Green silicon carbide 8000-10000 mesh, used for camera lenses, automotive cover glass, and light guide plate mirror processing to ensure light transmittance.

3. Double-sided polishing films for semiconductor and ceramic substrates: Polishing films for thinning and scratch removal of alumina ceramics, aluminum nitride substrates, silicon carbide substrates, and piezoelectric ceramic wafers; Coarse polishing green silicon carbide 240-600mesh, medium polishing green silicon carbide 2000 grit, mirror polishing green silicon carbide 6000-8000mesh

4. PSA self-adhesive silicon carbide polishing films: Comes with pressure-sensitive adhesive, allowing direct adhesion to polishing pads; widely used in the processing of mobile phone glass, small quartz crystal components, and small cemented carbide parts.

II. Non-woven/Flocked Base Flexible Polishing Film

1. Non-woven Flocked Polishing Film: Green silicon carbide 600-1500mesh, large pores, not easy to clog chips. Applications: Stamping dies, carbide tools, stainless steel parts, aluminum alloy workpieces, removing EDM marks and sandblasting residue.

2. Velcro-backed sanding disc film, compatible with handheld polishers, wet and dry use.

III. Waterproof and Water-resistant Silicon Carbide Abrasive Sandpaper/Wet Polishing Film
Available in rolls, square sheets, and round discs; grit range: Green silicon carbide 80#-6000mesh. Suitable for: Wet polishing of optical glass, sapphire, stone and carbide.

IV. Customized Grinding Films for Special Functions

1. Resin-cured thickened grinding film: Used for mass thinning of ceramic substrates, resulting in longer wear resistance and lifespan.

2. Ultra-thin film grinding disc (thin PET substrate): Used for precision machining of fiber optic ferrules and small piezoelectric wafers.

3. Long strip grinding belt film: Used for grinding long workpieces and ceramic roller surfaces.

4. Metallographic sample grinding film: Used for grinding metallographic sections of electronic components.

V. Sizes and corresponding D50 of green silicon carbide GC micro powder routinely produced by our factory (Zhengzhou Haixu Abrasive Co., Ltd.)

Jis standard

FEPA  Standard

W Standard