The reason of green silicon carbide GC powder for grinding optical waveguide glass substrates
Green silicon carbide GC also called Green carborundum or Green SiC,is produced in electrical internal resistance furnaces from silica sands and petroleum coke(added salt during smelting),with high hardness,thermal conductivity and strength.
Now list the reasons of green silicon carbide GC powder for grinding optical waveguide glass substrates
1. High cutting removal efficiency, suitable for rapid thinning in large quantities
Green silicon carbide GC has high Mohs hardness and good self-sharpening of edges and corners. Under the same conditions, the removal rate is much higher than that of FO alumina grinding composite powder and white corundum. The large plate glass after slicing can quickly remove cutting knife marks and thick margins, improve the production line rhythm, and is suitable for the rough grinding process of large-size optical waveguide substrates.
2. Good adaptability to hard and brittle glass, the crushing and grinding mechanism matches the glass
The optical waveguide is a hard and brittle optical glass. The green silicon carbide GC abrasive grains micro-collapse after being stressed to form a new cutting edge, which ensures continuous and stable cutting. Compared with white corundum, plastic extrusion is less likely to occur, and the material peeling off during the rough grinding stage is more efficient.
3. Good thermal stability, grinding is not prone to thermal cracks
Green silicon carbide GC has good thermal conductivity, and the grinding heat can be quickly exported, reducing local overheating of the glass and reducing the risk of thermal cracking and residual thermal stress of the optical waveguide substrate during the rough grinding stage.
4. Good suspension and dispersion, suitable for circulating grinding fluid in double-sided grinders
The settlement of high-purity graded green silicon carbide GC micro powder is controllable, and it is formulated into a water-based slurry for long-term circulation. The disc surface is cut evenly, and the TTV (total thickness deviation) consistency of the entire substrate is better, which facilitates the subsequent FO lapping powder grinding process.
5. The purity is controllable and can achieve low iron and low impurities.
Optical grade green silicon carbide GC has been pickled to remove impurities and has low iron impurities. It is not easy to leave stains and stains on the glass surface during the rough grinding stage, reducing the pressure of subsequent cleaning.
In Summary,Green silicon carbide GC micro powder has high hardness, strong self-sharpening, and high removal efficiency. It can quickly remove cutting knife marks and excess from optical waveguide glass. It has excellent thermal conductivity, reduces the risk of thermal cracking of glass, and has stable powder classification. It is suitable for double-sided rough grinding of large-size optical waveguide substrates and provides qualified blanks for the FO lapping powder grinding process.