Applications of green silicon carbide GC micropowder in the optoelectronic industry

Applications of green silicon carbide GC micropowder in the optoelectronic industry

The core advantages of green silicon carbide GC micro powder are: high purity (SiC≥99%), low iron and low heavy metal content, Mohs hardness 9.4~9.5, strong self-sharpening ability, acid and alkali resistance, good thermal stability, and suitability for grinding, cutting, sandblasting, and functional filling of all types of hard and brittle materials in the optoelectronic industry.

I. Photovoltaics

1. Wire Cutting Abrasive for Crystalline Silicon Wafers

        1. Traditional Slurry Cutting: Green silicon carbide (GC) micropowder is mixed with cutting fluid to form a slurry for cutting monocrystalline and polycrystalline silicon ingots, suitable for photovoltaic cell cutting; the particles are sharp and concentrated, resulting in shallow silicon wafer damage, uniform TTV thickness, less chipping, and easy cleaning without metal residue contaminating the silicon substrate. Commonly used green silicon carbide (GC) grades: 800mesh, 1000mesh, 1200mesh.

        2. Diamond Wire Abrasive Material: Electroplated/resin-coated diamond wire with attached green silicon carbide micropowder assists in high-speed cutting of photovoltaic silicon wafers and thin silicon wafers, balancing lifespan and cutting yield.

2. Texturing the Back of Silicon Wafers (Essential for PERC Photovoltaic Cells)
F800~F2000 green silicon carbide (GC) micropowder is used to grind the back of silicon wafers, creating uniform micro-pits to improve infrared light absorption and increase photoelectric conversion efficiency; strict control of iron content ≤0.05%, as iron impurities can form carrier traps, directly reducing cell power generation efficiency. Roughness is stably controlled at Ra 0.12~0.22μm.

3. Double-sided grinding and CMP rough polishing of silicon wafers

Double-sided thinning, chamfering, and pre-polishing of 3~12 inch photovoltaic/semiconductor silicon wafers; CMP rough polishing using ultrafine green silicon carbide GC micropowder (6000 mesh, 8000 mesh, 10000 mesh), replacing some expensive polishing slurries, reducing lattice damage, and improving yield.

4. Grinding of high-purity quartz components for photovoltaics

Fine grinding and polishing of the inner and outer walls of quartz crucibles, quartz boats, photovoltaic quartz tubes, and diffusion quartz components; green silicon carbide GC micropowder is resistant to hydrofluoric acid, does not precipitate metal, and will not contaminate high-purity quartz components in high-temperature photovoltaic processes.

II. Optical Glass & Precision Optical Components (Lens, Automotive Optics, AR/VR) Suitable for various types of hard and brittle optical glass, infrared crystals, and laser lenses. Processing is divided into rough grinding → semi-fine grinding → fine grinding → ultra-fine polishing using graded powders:

1. Ordinary Optical Lenses (Cameras, Microscopes, Security Lenses)

    Rough Grinding: 1000mesh~1500mesh Quickly removes machining marks;

    Semi-fine Grinding: 2000mesh~2500mesh Eliminates deep scratches and homogenizes the surface;

    Fine Grinding/Ultra-fine Grinding: 3000mesh~10000emesh, final roughness Ra≤2nm, light transmittance increased by 1%~2%, no pitting or scratches.

2. High-end Optoelectronic Components

 Automotive LiDAR lenses, AR/VR waveguides, lithography machine optical prisms, infrared windows, endoscope lenses; requires high-purity green silicon carbide GC micro powder to eliminate iron and aluminum impurities that cause light transmission spots.

3. Grinding of mobile phone/tablet display glass cover glass

LCD/OLED substrate, light guide plate, and backlight optical film substrate; 4000#~8000 mesh ultrafine powder to ensure screen flatness, smooth touch, no scratches, and high yield.

III. Optical Fiber Communication Industry
Green silicon carbide (GC) micropowder is an essential raw material for optical fiber end-face polishing. It is used to make silicon carbide polishing sandpaper/film, compatible with all FC/SC/LC/MT/MPO fiber ferrules:

1. Coarse Grinding and Removal of Adhesive: 400mesh~1200mesh micropowder is used to make polishing pads to polish the ceramic ferrule end face, removing cured epoxy resin adhesive and burrs;

2. Semi-Fine Leveling: 1500mesh~3000mesh micropowder is used to correct the end face tilt angle and ensure the coaxiality of the fiber connection;

3. Batch Polishing of Multi-Channel MPO Ferrules: A full-process gradient green silicon carbide (GC) micropowder polishing process ensures consistent insertion loss across multiple fiber cores.

4. Advantages: Low impurities prevent scratching of the fiber core; chemically stable and not corroded by polishing and cleaning solutions.

IV. LED and Third-Generation Semiconductor Substrate Processing

1. LED Sapphire Substrate (Core Substrate for Blue LEDs)
Sapphire has extremely high hardness; white corundum is inaccessible, and diamond is too expensive. Green silicon carbide micropowder is used for sapphire slicing, back-side thinning, and epitaxial surface pretreatment grinding. Standard grit: 2000#~6000#; fine polishing uses 8000~10000 grit to control substrate flatness and ensure the quality of LED epitaxial wafer growth.

2. Third-Generation Semiconductor Wafer Grinding
Grinding, chamfering, and back-side polishing of SiC single-crystal substrates, GaN gallium nitride, and gallium arsenide wafers; green silicon carbide has a matching hardness with the SiC substrate, resulting in low processing stress and reduced chipping, and is widely used in power optoelectronic chips and RF optoelectronic device processes.

3. Piezoelectric Optical Crystals
Grinding and polishing of lithium niobate, lithium tantalate, quartz crystal oscillators, and acousto-optic modulation crystals; these optoelectronic crystals are used in optical modulators and optical switches. Green silicon has no heavy metal contamination, ensuring the stability of optoelectronic signals.

V. Precision Sandblasting of Optoelectronic Components (PCB Carriers, Optoelectronic Device Housings)
Special Abrasives for Wet Fine Sandblasting in the Optoelectronic Industry:

1. IC Carriers, Flexible FPC Optoelectronic Circuit Boards: 800mesh~1500mesh Green Silicon Carbide GC Micropowder, wet sandblasting, micro-roughening of the copper surface, enhancing the adhesion of dry film and solder resist ink; simultaneously removing adhesive residue and deburring circuit lines.

2. Aluminum Alloy Optoelectronic Cavities, Lens Metal Housings Sandblasting: Fine-grit Green Silicon Carbide GC Micropowder matte sandblasting, resulting in a uniform and delicate surface, balancing rust prevention and coating adhesion.

3. Rigorous Requirements: Acid pickling to remove iron, magnetic separation to remove impurities, low water-soluble salt content, preventing optoelectronic components from oxidizing due to moisture and short circuits.

VI. Functional Fillers (Optoelectronic Specialty Coatings, Insulating Composite Materials)

Ultrafine green silicon carbide GC powder (6000 mesh or finer) is added as a filler, primarily used in optoelectronic functional coatings:

1. Antistatic/Insulating Shielding Coatings

 Conductive adhesives, EMI electromagnetic shielding coatings, circuit board insulating protective paints: Green silicon carbide combines insulation, high thermal conductivity, and wear resistance. Adding it allows the housings of optoelectronic equipment and circuit boards to provide antistatic heat dissipation and abrasion resistance, making it suitable for coatings on optical modules and optoelectronic transceiver housings.

2. High-Temperature Resistant Optoelectronic Protective Coatings

Wear-resistant and corrosion-resistant coatings for lens metal parts and semiconductor equipment cavities, improving temperature resistance and acid/alkali corrosion resistance.

3. Optoelectronic Encapsulation Epoxy Fillers

Adding ultrafine green silicon reduces the thermal expansion coefficient of the encapsulation resin, making it suitable for the high and low temperature operating environments of optoelectronic components.

VII. Raw Materials for Optoelectronic Supporting Bonded Abrasives

Optoelectronic processing plant manufactures its own grinding wheels, oilstones, and grinding strips:

1. Ceramic-bonded green silicon carbide grinding wheels for grinding optical glass, sapphire, and ceramic ferrules;

2. Resin grinding wheels for quartz parts and crystal grooving and trimming; all are made of electronic-grade low-iron green silicon carbide to avoid contaminating the workpiece during processing.

Ⅷ.The normal sizes and its D50 Value for manfacturer of Zhengzhou haixu abrasives co.,ltd are as follows:

JIS Standard

FEPA STANDARD