Application of black silicon carbide SiC in electrical engineering
The application of black silicon carbide SiC in electrical engineering is mainly reflected in the following fields:
1. Manufacturing of electric heating elements
Due to its excellent high-temperature stability and conductivity, black silicon carbide SiC is often used to manufacture electric heating elements in equipment such as resistance furnaces and electric heaters, especially suitable for long-term high-temperature working environments.
2. Semiconductor and superconducting materials
High-temperature semiconductor materials: Black silicon carbide SiC can be used as a high-temperature semiconductor substrate to make power devices and high-temperature electronic components, and improve the stability of equipment under extreme temperatures.
Superconducting materials: In the field of high-temperature superconductivity, black silicon carbide SiC is used as a key component in superconducting coils and magnet materials.
3. Power system protection devices
Lightning arrester valve plate: The varistor characteristics of black silicon carbide SiC make it the core material of lightning arrester valve plate, which is used for overvoltage protection of high-voltage power grid systems.
High-frequency electromagnetic interference materials: In electronic packaging, black silicon carbide SiC-based materials are used to suppress high-frequency electromagnetic interference and improve the anti-interference ability of circuit systems.
4. Heat dissipation and thermal management
Thermal conductive filler: By adding black silicon carbide SiC powder to electronic ceramics, the thermal conductivity of the material can be greatly improved, solving the problem of heat dissipation of electronic components.
Far infrared radiation material: Made into far infrared panels, used as radiation sources in high-efficiency thermal energy conversion equipment or heating systems.
5. Electronic packaging and substrates
In the field of electronic packaging, black silicon carbide SiC ceramics are used as precision components such as integrated circuit packaging substrates and wafer carriers due to their high thermal conductivity, electrical insulation and low thermal expansion coefficient, which meet the needs of high power density scenarios.
Typical application examples:
In the semiconductor industry, black silicon carbide SiC ceramic sheets can be used as insulating carriers in wafer manufacturing, as heat dissipation substrates for high-power devices, and integrated into arrester valve sheets to achieve dual-function protection.